Schroff backplanes are the result of 40 years of experience, continued research and innovations in the area of backplane development. By active cooperation in standardization committees Schroff creates the standards of the future. Ideal layout allows high signal quality and economic production. Skilled developers and modern design tools ensure our high quality standard. Simulation tools and measuring devices as well as self developed high performance measuring adapters allow the development of new technologies and topologies on the highest level. The solder paste print is one of the process steps in the backplane production that determines quality. Our new innovative solder paste printer, based on inkjet technology, allows a fast, flexible and highly reliable solder paste print. The procedure does not require a template; the print program can be changed within seconds. Thereby also small numbers can be printed at low costs. Our up-to-date SMD assembly machines support a large assembly spectrum at high volume outputs. Small and high volumes can be realized flexibly and time efficient.

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